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Meizu Pro 6 : Everything We Know till Now

We are just a couple of days away from the official unveiling of Meizu’s next smartphone, the Meizu Pro 6. Meizu Pro 6 is the part of the new set of smartphones that was set to be unveiled during these days. We have already witnessed the official unveiling of the Huawei P9 from this flock. The HTC 10 is set to come out of the curtains tomorrow and the Meizu Pro 6 will be here after that.

In the past couple of days, a number of leaks, rumours and teasers has appeared to add spice up the wait for this smartphone. Earlier today, Meizu itself teased the fast charging feature of the upcoming Pro 6 and now some pictures next Meizu stunner have appeared again. In the leaked pictures, a beautiful Pro 6 can be seen in white boasting off a beautiful design.

Apart from the leaked pictures, screenshots of Meizu Pro 6’s Antutu score has also surfaced which further conform the specifications of this device. Meizu Pro 6 has a score of 91,165 on Antutu, which is far low as compared to the score of 100,000 put on the board by many other high-end smartphones. Meizu Pro 6’s point of attention is its MediaTek Helio X25 chipset which is a deca-core CPU accompanied by Mali-T880 MP4 GPU. MediaTek Helio X25 is expected to be the Meziu Pro 6 exclusive chipset.

Specifications of this smartphone include a 5.2-inch AMOLED dipaly with 1080 x 1920 pixels resolution. A RAM of 4GB which is a standard for today’s flagship smartphones can be found inside Meizu Pro 6. Native apps on this phone will also allow the users to use the Force Touch feature. A 2 MP camera is going to be fixed at the back and to entertain the selfie freaks, a 5 MP shooter is expected on the front. Meizu Pro 6 will feature dual nanoSIM slot.

Meizu Pro 6 is set to make an appearance on Wednesday. We might see a Meizu Pro 6 Plus alongside the original Pro 6 as well. We are keeping a close eye on every bit of information regarding Pro 6. Stay tuned until anything new comes out.

Bhakti Dua covers Technology and Automotive industry.

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