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LeEco Le 2 images and features leak online

Not much time have passed since the released of LeEco Le1S. Now, a report has emerged that its successor Le 2 is under works.It is being said that Le 2 have a square shape fingerprint sensor and the company's brand graving below the bio-metric sensor now shows "LE" (simplified form of LeEco). Le 1S comes with a circular camera module and the brand engraving spells LeTV (the company's former name). The Le 2 is encased in a chamfered metal frame.

As far as internal hardware is concerned, Le 2 is expected to house either Qualcomm's Snapdragon 820 Quad-core SoC (System-on-Chip) or MediaTek's Helio X20 Deca-core processor backed by 4GB RAM.

It also expected to have a 21MP rear camera  and a much improved ultrasonic-based fingerprint sensor.The leaked pictures of the Le 2 seem great, but the device's internal specification casts doubts. 

For instance, Snapdragon 820 is a very powerful processor, it is coming in Samsung Galaxy S7 series, LG G5, Xiaomi Mi 5 and other flagship phones slated to be released in 2016, so it is very unlikely a budget phone like the Le 2 will house such a CPU.

These are leaked images of LeEco Le 2.

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